TensorFlow: Revolutionizing Large-Scale Machine Learning in Complex Semiconductor Design

Authors

  • Rajat Suvra Das Business Development L&T Technology Services

DOI:

https://doi.org/10.47941/ijce.1812

Keywords:

Semiconductor Design, Machine Learning, Tensorflow, Google, PRISMA

Abstract

The development of semiconductor manufacturing processes is becoming more intricate in order to meet the constantly growing need for affordable and speedy computing devices with greater memory capacity. This calls for the inclusion of innovative manufacturing techniques hardware components, advanced intricate assemblies and. Tensorflow emerges as a powerful technology that comprehensively addresses these aspects of ML systems. With its rapid growth, TensorFlow finds application in various domains, including the design of intricate semiconductors. While TensorFlow is primarily known for ML, it can also be utilized for numerical computations involving data flow graphs in semiconductor design tasks. Consequently, this SLR (Systematic Literature Review) focuses on assessing research papers about the intersection of ML, TensorFlow, and the design of complex semiconductors. The SLR sheds light on different methodologies for gathering relevant papers, emphasizing inclusion and exclusion criteria as key strategies. Additionally, it provides an overview of the Tensorflow technology itself and its applications in semiconductor design. In future, the semiconductors may be designed in order to enhance the performance, and the scalability and size can be increased. Furthermore, the compatibility of the tensor flow can be increased in order to leverage the potential in semiconductor technology.

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Author Biography

Rajat Suvra Das, Business Development L&T Technology Services

Senior Director

References

X. Vasques, Machine Learning Theory and Applications: Hands-on Use Cases with Python on Classical and Quantum Machines. John Wiley & Sons, 2024.

A. Chopra, A. Modi, and B. Singh, "Machine Learning Algorithm With TensorFlow and SciKit for Next Generation Systems," in Machine Learning Algorithms Using Scikit and TensorFlow Environments: IGI Global, 2024, pp. 17-49.

C. DeLozier, J. Blanco, R. Rakvic, and J. J. S. Shey, "Maintaining Symmetry between Convolutional Neural Network Accuracy and Performance on an Edge TPU with a Focus on Transfer Learning Adjustments," vol. 16, no. 1, p. 91, 2024.

"What's new in TensorFlow 2.15," November 17, 2023.

O. G. Yalçın, "Applied Neural Networks with TensorFlow 2."

M. Ramchandani et al., "Survey: tensorflow in machine learning," in Journal of Physics: Conference Series, 2022, vol. 2273, no. 1, p. 012008: IOP Publishing.

D. L. Quoc, F. Gregor, S. Arnautov, R. Kunkel, P. Bhatotia, and C. Fetzer, "secureTF: A Secure TensorFlow Framework," arXiv preprint arXiv:2101.08204, 2021.

R. Butola, Y. Li, and S. R. Kola, "A machine learning approach to modeling intrinsic parameter fluctuation of gate-all-around si nanosheet MOSFETs," IEEE Access, vol. 10, pp. 71356-71369, 2022.

F. Kenarangi and I. Partin-Vaisband, "A single-MOSFET analog high resolution-targeted (SMART) multiplier for machine learning classification," IEEE Journal on Emerging and Selected Topics in Circuits and Systems, vol. 11, no. 4, pp. 816-828, 2021.

T. Hirtz, S. Huurman, H. Tian, Y. Yang, and T.-L. Ren, "Framework for TCAD augmented machine learning on multi-I–V characteristics using convolutional neural network and multiprocessing," Journal of Semiconductors, vol. 42, no. 12, p. 124101, 2021.

H. Kwak, S. Ryu, S. Cho, J. Kim, Y. Yang, and J. J. L. A. M. Kim, "Non-destructive thickness characterisation of 3D multilayer semiconductor devices using optical spectral measurements and machine learning," vol. 2, no. 1, pp. 9-19, 2021.

C. Mattmann, Machine Learning with TensorFlow. Simon and Schuster, 2020.

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Published

2024-04-19

How to Cite

Das, R. S. (2024). TensorFlow: Revolutionizing Large-Scale Machine Learning in Complex Semiconductor Design. International Journal of Computing and Engineering, 5(3), 1–9. https://doi.org/10.47941/ijce.1812

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Articles